Intel N100 mini PC*.
*= those are on the same process node as the problematic i7/i9 13th and 14th gen CPU. With Intel this quiet on the true cause/issue they might as well also be considered faulty.
EmilieEvans
joined 1 year ago
The biggest issue is battery size: If the heatbed cools down the print fails. The heating is the part that takes the most power so the battery has to be large enough to support the entire remaining print duration or power outage.
On Windows: I hate it too.
Takes up more space without any benefit. this version looks "modern" but from a usability standpoint, it is worse.
Hope Prusa goes in and makes the toolbar (Menu, Platter, Print Settings, filament, Printers, physical printer) small/less height and gives the buttons something to make them look like a button. Right now it is just text on a grey background. Big steps in the wrong direction in my opinion as it stands but easy to fix.
The addition of the physical printer page/tab is nice. Now I can view the Duet web interface directly in prusaslicer. While the printer are 99% upload and forget from time to time I need to view the control panel to check or adjust a thing or two.
MCUs can run Linux.
I don't use Espriff products so no idea if it is available for the ESP32.
A lot of people (probably) would have chipped in and be happy with a half-backed first-generation product. People loved the Ender 3 and even accepted the Anet A8 which would catch fire if not modified because it was all they could afford/buy.
Look no further than Micronics sift bin. It was jankey but it was what it took to hit this price point and people accepted it.
All of the buzz was about SLS being finally headed toward enthusiasts and small businesses. Adoption/market size getting bigger and suddenly good SLS is affordable in the near future. All of this was killed with this acquisition as FormLabs is the wrong company for this trajectory. Even the fact that FormLabs is asking $4k for the * privilege * to use third-party materials is a strong indicator.
Do we expect anytime soon that FormLabs will beat what is already out there? Sinterit Lisa: $10k: https://sinterit.com/3dprinters/lisa/
My money is on that the next/first budget SLS will be made and engineered in China. I don't know who will be next but it likely won't be another startup in the west.
The whole ecosystem here in the West doesn't favour starting up. It's not easy to do it in China either, but the whole supply chain is there (as such also the knowledge/support) and the business environment makes it more likely for it to happen there.
They are one of them. June 2024: Mozilla has acquired Anonym, [...]. This strategic acquisition enables Mozilla [...] deliver effective advertising solutions.
Might be a restructuring:
, the Company may need to file for bankruptcy protection in order to implement a plan of reorganization, or court-supervised sale and/or liquidation of the Company.
The issue with Weller is their price in a competitive market.
Considering no alternative the entry level Weller is fine. Ersa has their awesome itool with this really short distance between soldering iron tipp and finger grip: https://ts.kurtzersa.com/electronics-production-equipment/soldering-tools-accessories/soldering-desoldering-stations/produkt-details/i-con-pico-1.html
Performance: Weller and Ersa are more or less equal. For generic solder joints both are great. If there are high thermal mass and it isn't possible to use a large tipp than the Hakko T12 is the superior technology. Changing tips on the Ersa (while not recommended by the manufacturer) can be done with the iron heated up and tool free within 5 seconds.
Ergonomics: 100% Ersa. The only reason it has been my daily driver for half a decade and is here to stay. Before this station I actually had a Weller.
JBC has a similar tool handle to the Ersa but those are very expensive with little benefit.
The price to performance king are genuine Hakko T12 tipps with a China station.
The disclaimer says they’re trying to get it approved which implies they believe it could be
That's a tough one and I doubt they will succeed with this. As far as I know, they would need to certify a material + process (3d-printer & settings, slicer-software & settings) + 3D-model combination. Far easier to certify a product containing 3D-printed parts than a 3D model/file.
Plastic is the wrong material due to moisture building up inside and some other pitfalls.
At this point, it is not a technical issue but also a trust issue:
They started with people overclocking their CPUs and that is the cause.
They moved on to the mainboard vendors are the bad guy.
Now they are at we screwed up but the microcode update will fix everything and yes we had oxidation issues we told nobody about and no we won't recall those units we know are faulty (oxidation issue).
I think Intel now says it is everything with 65W+ TDP.