this post was submitted on 29 Nov 2024
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39
Huawei's homegrown AI chip examined — Chinese fab SMIC-produced Ascend 910B is massively different from the TSMC-produced Ascend 910 (www.tomshardware.com)
submitted 3 weeks ago by [email protected] to c/[email protected]
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cross-posted from: https://lemm.ee/post/48587136

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[–] [email protected] 9 points 3 weeks ago (1 children)

I wonder what the yield is on these wafers? 🤔

[–] [email protected] 8 points 3 weeks ago

This is a very interesting question, I speculate the process must be pretty good, otherwise it probably wouldn't be used for such large chips.

HiSilicon Ascend 910B measures 21.32 mm × 31.22 mm and has an enlarged die size of 665.61 mm²

Compare that to AMD making the first Ryzen chiplets only 200 mm² on the GloFo 14nm process, to maximize yields, which was a huge advantage in the competition against Intel.