this post was submitted on 22 Oct 2024
9 points (100.0% liked)

Hardware

106 readers
51 users here now

A community for news and discussion about the hardware side of technology.


Rules

1. English onlyTitle and associated content has to be in English.
2. Use original linkPost URL should be the original link to the article (even if paywalled) and archived copies left in the body. It allows avoiding duplicate posts when cross-posting.
3. Respectful communicationAll communication has to be respectful of differing opinions, viewpoints, and experiences.
4. InclusivityEveryone is welcome here regardless of age, body size, visible or invisible disability, ethnicity, sex characteristics, gender identity and expression, education, socio-economic status, nationality, personal appearance, race, caste, color, religion, or sexual identity and orientation.
5. Ad hominem attacksAny kind of personal attacks are expressly forbidden. If you can't argue your position without attacking a person's character, you already lost the argument.
6. Off-topic tangentsStay on topic. Keep it relevant.


If someone is interested in moderating this community, message @[email protected].

founded 3 months ago
MODERATORS
 

With AI showing no signs of slowing, TSMC will be ramping up its advanced chip packaging capabilities over the next few years. During its recent earnings call on October 17, the chipmaker revealed that its production capacity for CoWoS packaging technology is set to double year-over-year in both 2024 and 2025.

you are viewing a single comment's thread
view the rest of the comments
[–] [email protected] 1 points 2 weeks ago

Well, I sure hope it can be repurposed when the bubble bursts.